soumya
In the zone
At the Windows Hardware Engineering Conference (WinHEC) 2008, USB-IF President, Jeff Ravencraft revealed that the new specifications for USB 3.0 would be fully released on November 17 at the SuperSpeed USB Developers Conference in San Jose. The USB 3.0 architecture is also named SuperSpeed USB due to its incredible 5 gigabit per second (Gbps) data transfer speed.
*thefutureofthings.com/upload/items_icons/USB-3.0-mini.jpg
The USB 3.0 specification guarantees an increased performance of 10 times compared to the capabilities of the current USB 2.0, providing a bandwidth of 600 MB/s second. Devices employing USB 3.0 specifications are planned to be available to consumers in 2009 or 2010 and would be backwards compatible with USB 2.0 and USB 1.1.
“Delays have held USB 3.0 back,” said Lars Giusti of Microsoft. However, he predicts that the fully signed-off USB 3.0 specifications would only be presented to the implementers in the USB 3.0 Promoter Groups in 2009. Subsequently, it would take approximately another year until broad-scale product deployment of host controllers, devices, and systems utilizing USB 3.0 would be available in the market.
President and general manager of the chipset business unit at AMD, Phil Eisler, released a statement saying, "The future of computing and consumer devices is increasingly visual and bandwidth intensive. Lifestyles filled with HD media and digital audio demand quick and universal data transfer. USB 3.0 is an answer to the future bandwidth need of the PC platform.”
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*thefutureofthings.com/upload/items_icons/USB-3.0-mini.jpg
The USB 3.0 specification guarantees an increased performance of 10 times compared to the capabilities of the current USB 2.0, providing a bandwidth of 600 MB/s second. Devices employing USB 3.0 specifications are planned to be available to consumers in 2009 or 2010 and would be backwards compatible with USB 2.0 and USB 1.1.
“Delays have held USB 3.0 back,” said Lars Giusti of Microsoft. However, he predicts that the fully signed-off USB 3.0 specifications would only be presented to the implementers in the USB 3.0 Promoter Groups in 2009. Subsequently, it would take approximately another year until broad-scale product deployment of host controllers, devices, and systems utilizing USB 3.0 would be available in the market.
President and general manager of the chipset business unit at AMD, Phil Eisler, released a statement saying, "The future of computing and consumer devices is increasingly visual and bandwidth intensive. Lifestyles filled with HD media and digital audio demand quick and universal data transfer. USB 3.0 is an answer to the future bandwidth need of the PC platform.”
Source