"usually comes with the processor fan fixed on to the heatsink"
Well that goes without saying,I have never encountered a situation right from my P3 days where i had to install the fan on the heatsink
So considering this fact your comment seems a bit foolish to me.
There is a vast difference between a TERMAL PAD and a Thermal Paste. Both work differently.
^^ Thats your comment.Well they are in different physical form BUT they both do the MAIN function of transfering heat from the CPU IHS to the Heatsink.So how is there a VAST difference in their working? Thats my question.
They created Thermal PAD specially for this Processor type.
You are sadly mistaken,thermal pads have been used for a long time before the Prescott was even launched,so theoritically,Intel didnt invent the Thermal Pad if thats what you are trying to suggest here.
Thermal Pads are generally provided with the Heatsink keeping in mind the ease of installation.IF it was given in the thermal paste form,there is a chance that certain people would mess it up while installation due to lack of prio knowledge.
I again ask you to do the experiment yourself see the difference before you comment on such things.
My statements are based on personal experience,so relax,dont worry about that.
Instead of applying Thermal PAD while installing an LGA based Processor, apply the ordinary Thermal Paste which we use for the Socket 478 processor, you will yourself discover the difference.
Done that,didnt see any major difference.
Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.)
From AS site,
Well it goes without saying that after installing the CPU in socket, you apply a small drop of AS5 in the centre of the CPU IHS which is a metal plate.I dont see how it would damage any pins,unless the user is really messy to screw up while application of AS5.
Absolute Stability:
Arctic Silver 5 will not separate, run, migrate, or bleed.
That means that the AS5 SUBSTANCE wont disintegrate into its ingredients .That doesnt mean that it will act as adhesive in between the CPU IHS and the heatsink.
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
the measured temperature will often drop 2C to 5C over this "break-in" period
its what THEY say, i am speaking after personal experience.
Even though Arctic Silver thermal compound is specifically engineered for high electrical resistance, you should keep the compound away from processor, memory, and motherboard traces and pins.
I guess i have made my stand clear above.
Thermal pads are made with paraffin wax that melts once it gets hot. When it melts, it will fill in the microscopic valleys in the heatsink with wax
Its one of its physical properties.It DOES not have any connection with the main function of heat transfer.
Oh yes! besides, the training, all companies provides training to there dealers. So, I got the training understood.
Well even though i am not a dealer,i have attended these technical workshops from AMD many times,so relax.I know how they train,they do it very professionally but then not all people present there can comprehend what exactly the guy giving the demonstration is trying to tell.
I hope you have got the real outlook of my questions and that should have convinced you till now that i am not dumb enough not to understand simple english.
...so do consider those ..
