darklord said:
Intel has come up with THERMAL PAD, Which usually comes with the processor fan fixed on to the heatsink.
You mean to say that the Heatsink is fixed on the CPU when it is in boxed condition ?? frankly that comment of yours doesnt make any sense to me. :roll:
There is a vast difference between a TERMAL PAD and a Thermal Paste. Both work differently.
Really ? i didnt know that,care to explain ??
Next you were talking about the Artic Silver, let me remind you that not only this compound is costly, it does not make much of a difference to temperature, only say 5 C of temp drop.
AS5 never reduces temperatures,it reduces the time required for bringing down temps when CPU is brought back to idle state from 100% load.
Another thing to note about this compound is that , its a permanent compound, you won't be able to separate your Processor with the heatsink untill and unless you apply a huge amount of strength
Yes you can.I have done that zillions of times,without damaging a single processor.
And if at all you apply such a strength to separate the processor with the heatsink, you may permanently damage the processor since, this processor has a different interface (opposite of what we had with the socket 478).
How could you possibly damage a LGA based CPU physically ???
I fail to understand or imagine that.
And for your info, don't think you are the only one who knows everything about cooling. I am a professional assembler myself and have undergone company training from Intel, Microsoft, and HP.
Well since when did Multinationals like Intel,HP start giving such horrific training?
Looking at your posts i am pretty sure,you were snoaring away to glory while the so-called training sessions were going on...
In my opinion, giving advice to people without warning them of suck situations is not a good advice at all.
That applies to you too buddy.Infact giving wrong advice and putting forward wrong concepts is even more dangerous.
Someone once said,wrong knowledge is dangerous than half knowledge or soemthing like ,i dont remember now...lol
But seriously man,your post made me laugh.Thanks for entertaining me.
Nice to see your comments dude,
It seems to me that you don't even know to read ENGLISH !!!!
Quote
"usually comes with the processor fan fixed
on to the heatsink"
Unquote
So you don't even understand the meaning of the above sentense, it clearly says,
That the Prescott Processor Fan comes with the heatsink, and the Thermal Pad it fixed to the heatsink. ..... and I never said that the CPU comes fitted to the heatsink. Hope you now understand.
Secondly, I am astonished to note that you yourself doesnot know the difference between the Thermal PAD and the Thermal Paste and is taking part in discussion on such topics, which you are not aware of.
Frankly speaking, Intel is not FOOL company to make Thermal PAD for its Prescott Processor when the old Thermal Paste would still do the same work. They created Thermal PAD specially for this Processor type.
I again ask you to do the experiment yourself see the difference before you comment on such things.
EXPERIMENT:
Instead of applying Thermal PAD while installing an LGA based Processor, apply the ordinary Thermal Paste which we use for the Socket 478 processor, you will yourself discover the difference.
Below i give you a quote from the website of Aritic Silver itself, see what they themselves say about it.
Hope this opens your EYES forever.
***
Controlled Triple-Phase Viscosity:
Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the tube, Arctic Silver 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability.
(
This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.)
Not Electrically Conductive:
Arctic Silver 5 was formulated to conduct heat, not electricity.
(While much safer than electrically conductive silver and copper greases,
Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.)
^ So this is how the CPU can be permanently damaged.
Absolute Stability:
Arctic Silver 5 will not separate, run, migrate, or bleed.
--------------------------------------------------------------------------------
Specifications:
Thermal Conductance:
>350,000W/m2 °C (0.001 inch layer)
Thermal Resistance:
<0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size:
<0.49 microns <0.000020 inch
Extended Temperature Limits:
Peak: –50°C to >180°C Long-Term: –50°C to 130°C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
Arctic Silver 5 is sold in 3.5 gram and 12 gram tubes. The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.
--------------------------------------------------------------------------------
Important Reminder:
Due to the unique shape and sizes of the particles in Arctic Silver 5's conductive matrix, it will take a up to 200 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink or with a low speed fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode,
the measured temperature will often drop 2C to 5C over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.
^ And you were saying there will be NO drop in temperature, silly you!!!
Even though Arctic Silver thermal compound is specifically engineered for high electrical resistance,
you should keep the compound away from processor, memory, and motherboard
traces and pins. There is a possibility that dust or metal particles and/or shavings carried by the airflow inside the computer case could contaminate the compound and increase its electrical conductivity.
^ Understood something ? This is how damage could be caused
Thermal pads are made with paraffin wax that melts once it gets hot. When it melts, it will fill in the microscopic valleys in the heatsink with wax
^ This is one of the many differences between a Thermal PAD and Thermal Paste
Hope this helps! If you need for post back.
And good luck.
Oh yes! besides, the training, all companies provides training to there dealers. So, I got the training understood.
