@vkl sandy uses solder b/w chip and ihs. the thermal conductivity of solder is far better than thermal paste. At ocn people who used a thermals paste callled coolaboratory its almost is a liquid metal paste had way better temps than generic thermal pastes. I mean if they just soldered that goddamn chip to ihs there would ve not been any heat problems.
Yeah,that's what I wrote and implied.
This is a very informative thread on that:Delidded my i7-3770K, loaded temperatures drop by 20°C at 4.7GHz
After delidding the temperature drops like 20 degree Celsius and more are a direct result of distance reduction between CPU die and IHS.You will notice that the default TIM even outperformed noctua NT-H1 in those tests.Yes,a better TIM would see some degree drop in temperatures.But majority of drop comes from distance reduction in case of ivy bridge.
Had soldering been used in place of TIM paste,or IHS to CPU die gap was lesser then it would have been much better.They wanted to cheap out or cut cost,mostly a cost cutting measure or may be to reduce design complexity.