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Making a heterogeneous processor or a Die consisting of different type of cores with inbuit interconnect is not an easy job and they are far more complex than creating current generation multicore homogeneous processors where all the cores are of same type.
AMD has been working on this field for last 5-6 years, even before the launch of their Phenom (1) processors and it is like Intel's Larabee project.
So don't expect Intel to just implement some equivalent technology sooner. It is not so easy. By the way, even llano CPU core is actually based on K10 architecture which is currently in use in Phenom II/Athlon II processors, it is going to have a lot of tweaking.
The fabrication process will be 32 nm, so expect more Transistors in a die, less power consumption and less heat. Also the it allows the processors to run at very high speed. It can also help to integrate a more efficient and fast memory controller to increase the Memory rad/Write performance...a field where AMD is lagging in quiet a margin from Intel.
AMD has been working on this field for last 5-6 years, even before the launch of their Phenom (1) processors and it is like Intel's Larabee project.
So don't expect Intel to just implement some equivalent technology sooner. It is not so easy. By the way, even llano CPU core is actually based on K10 architecture which is currently in use in Phenom II/Athlon II processors, it is going to have a lot of tweaking.
The fabrication process will be 32 nm, so expect more Transistors in a die, less power consumption and less heat. Also the it allows the processors to run at very high speed. It can also help to integrate a more efficient and fast memory controller to increase the Memory rad/Write performance...a field where AMD is lagging in quiet a margin from Intel.