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Btw, I have no idea how this "heat pipes" work. The basic idea is to have as much surface area as possible for maximum heat dissipation. Whether the heat pipes implement some other techniques, I'm not sure.
and good conductor (copper) to quickly conduct heat evenly... thats all.. no other funda
what all mobo designers strive is to reduce the weight/amount of copper at the same time expose maximum area possible for heat dissipation and make the walls sufficiently thick to conduct heat evenly over the entire heat pipe.
BTW coming to the topic, a thermal conductor paste should have good conduction properties also during high temperatures.. which most other substitutes fail at... for many substitutes when the temperature increases, the heat conduction capacity reduces dramatically. so even if a substitute seems to conduct well at normal temperatures it will not be same at higher temperatures. and other points that come into picture are repeatability, reliability, chemical reactions with the metal like being corrosive or physical reactions with rise in temperature like expanding, adhesiveness with the metal etc are also important.
so just applying some stuff that conducts might be done for hobby/experimental purpose, while nothing can replace a good branded thermal paste
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