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Known as Fab 32, the $3 billion factory will be used to manufacture the company's latest microprocessor line. The first 45-nm microprocessor, known as "Penryn," will be launched on Nov. 12.
"It's another step in the continuing execution in Intel manufacturing," John Pemberton, the Fab 32 plant manager, said during a presentation officially opening the new facility.
Interestingly, Intel did not release production data for the new facility, and Pemberton declined to comment when asked at the launch. The company also will not allow cameras inside the facility at a press event on Thursday morning, according to a company spokeswoman. Even Intel employees who aren't directly involved in manufacturing have been prohibited from touring the fab floor, a company spokeswoman said.
What is known is that the Fab 32 facility contains 1 million square feet of space, of which 184,000 square feet is actually dedicated to the "clean room" manufacturing facility. About 86,000 cubic yards of concrete were used as part of the structure, as well as 110,000 tons of steel. More than 1,000 employees will work there, Intel said.
Intel began manufacturing 45-nm chips in its D1D facility in Oregon this past January, but the Chandler facility is the first high-volume production facility. Fab 32 is Intel's sixth 300mm wafer factory; two additional 45-nm facilities using 300-mm wafers will open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x).
The first 45-nm production wafer rolled off the line several weeks ago, Pemberton said. However, the fab was officially opened on Thursday, in line with the company's expectations.
Manufacturing has increasingly become an important part of Intel's business, as Intel arguably owns the most advanced fabs in the world. The company is at least a half to a full generation of manufacturing technology ahead of its closest competitor in the PC microprocessor space, AMD. Taiwan superfoundry Taiwan Semiconductor Manufacturing Co. (TSMC) is scheduled to bring its own 45-nm technology online for production this quarter, but TSMC has not yet made its own production announcement.
Intel's 45-nm gates use a hafnium high-k material to reduce capacitance but minimize leakage current.
Intel also said it would seek Leadership in Energy and Environmental Design (LEED) factory status, a recognition that's based on environmentally sustainable construction. The company also reuses 70 percent of the water used in the fabrication of the chip wafers.
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"It's another step in the continuing execution in Intel manufacturing," John Pemberton, the Fab 32 plant manager, said during a presentation officially opening the new facility.
Interestingly, Intel did not release production data for the new facility, and Pemberton declined to comment when asked at the launch. The company also will not allow cameras inside the facility at a press event on Thursday morning, according to a company spokeswoman. Even Intel employees who aren't directly involved in manufacturing have been prohibited from touring the fab floor, a company spokeswoman said.
What is known is that the Fab 32 facility contains 1 million square feet of space, of which 184,000 square feet is actually dedicated to the "clean room" manufacturing facility. About 86,000 cubic yards of concrete were used as part of the structure, as well as 110,000 tons of steel. More than 1,000 employees will work there, Intel said.
Intel began manufacturing 45-nm chips in its D1D facility in Oregon this past January, but the Chandler facility is the first high-volume production facility. Fab 32 is Intel's sixth 300mm wafer factory; two additional 45-nm facilities using 300-mm wafers will open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x).
The first 45-nm production wafer rolled off the line several weeks ago, Pemberton said. However, the fab was officially opened on Thursday, in line with the company's expectations.
Manufacturing has increasingly become an important part of Intel's business, as Intel arguably owns the most advanced fabs in the world. The company is at least a half to a full generation of manufacturing technology ahead of its closest competitor in the PC microprocessor space, AMD. Taiwan superfoundry Taiwan Semiconductor Manufacturing Co. (TSMC) is scheduled to bring its own 45-nm technology online for production this quarter, but TSMC has not yet made its own production announcement.
Intel's 45-nm gates use a hafnium high-k material to reduce capacitance but minimize leakage current.
Intel also said it would seek Leadership in Energy and Environmental Design (LEED) factory status, a recognition that's based on environmentally sustainable construction. The company also reuses 70 percent of the water used in the fabrication of the chip wafers.
Source
