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This topic is to ask questions about the new technology you don't know how it works.So,ask the geeks and they will give their best.Here is my first throw,
How does the stack cooling works?
This cooling is used in the asus's latest mobo(LGAP5D2).it is noiseless and more effective cooling.So guys, get going


It's basically a additional PCB layer with Aluminium/Copper heatsink/plate placed directly below motherboardPCB to take off heat generated by components such as Voltage Regulators,Chokes,Capacitors..They claim temp. lowers to 10degC ,but this is too optimistic.

Read more here:-
and here:-
Asus Stack Cool is basically an aluminum heat spreader which sits on the back side of the motherboard PCB, around the area where the CPU and Intel 925X MCH would be on the front of the motherboard. The Stack Cool Heat spreader helps dissipate heat from these areas but getting it directly away from the heat producing components, which in theory should help platform longevity and increase overclockability. Asus claims that Stack Cool can cut CPU temperatures by 10C


Cyborg Agent
Anyone who has done extensive work on PCBs will know that a large copper area is a good aid in dissipating heat. Trying to desolder a component that's soldered to a wide copper area using an ordinary soldering iron can be a frustrating *@#!!&%! job because the copper sheet takes away heat so rapidly that the solder has no time to melt. This is especially true when the copper area is in an inaccessible mid-layer.

IOW, this is not a new technology. It's been used for decades. I've been using it for my own designs for years and years. Maybe Asus has recently decided to concentrate on using this technique as much as possible.

However, the PCB copper area alone cannot substitute for the drastic cooling needed for high-power components such as the CPU.


Now MSI has included new cooling techonlogy (or rather method) in their Graphic cards called T.O.P TECH, T.O.P means Thermal Obviation Protection.They claim a decrease of 8degC to 9degC in the temperature and also less noise.
The heat sink is made of Copper.
See the comparions chart here:-


Santosh Halemani said:
yeah,but how r u going to cool the ambient temp. if there is no proper air movment in the cabinet. :wink:

See,not every motherboard needs fan,only some high performance motherboards do have fan,that too only for the chipset.
And for the rest of the components of ther mother board dont have and heatsink or cooling fan.
What Asus did was to provide a heatsink for entire mother board itself so that heat dissipates off the board quikly,thus lowering the temperature.
There will be some air movement inside the cabinet due to the Processor fan and the SMPS fan and in some cases Cabinet fan.


Santosh Halemani said:
Ok,here is my second throw.How does PCI and PCI-express differ from each other?Also, do the whole mobo technology changes?
PCI and PCI express are the buses to interface the external devices.
PCI is an old standard which has it's speed limited to 33MHz and in some Servers it is boosted to 66MHz(64bit).
PCI-Express is a new standard which is mush faster than PCI and AGP.
It comes in several flavours namely 1x,2x..
This table might give the idea.
PCI 132 MB/s
AGP 8X 2,100 MB/s
PCI Express 1x 250 [500]* MB/s
PCI Express 2x 500 [1000]* MB/s
PCI Express 4x 1000 [2000]* MB/s
PCI Express 8x 2000 [4000]* MB/s
PCI Express 16x 4000 [8000]* MB/s
PCI Express 32x 8000 [16000]* MB/s
IDE (ATA100) 100 MB/s
IDE (ATA133) 133 MB/s
SATA 150 MB/s
Gigabit Ethernet 125 MB/s
IEEE1394B [firewire]100 MB/s
*Each 1x lane in PCI Express can transmit in both directions. In the table the first number is the bandwidth in one direction and the second number is the combined bandwidth in both directions.
More info here.
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